|
|
|
: BGA Lens : BGA Stand : Sample Images : Specification :
|
|
|
|
General Introduction
|
|
As the world of electronics production continues to push
toward ever-smaller components and packages, as well as ever-higher
standards of quality, the job of providing visual inspection equipment
that gets the job done is a continuous challenge. However, for more
than 20 years Hirox has been doing exactly
that - applying its technical expertise in optical design and
manufacturing to provide only the highest quality solutions for the
inspection requirements at hand.
The new Hirox BGA inspection lens, the MX-BGAZ,
in the newest member of the Hirox Hi-Scope
video microscope lens family, providing users the most flexible method
for performing visual inspection of BGA components, including Micro BGA's. The BGA inspection lens can be used with any
Hi-Scope camera and lighting main units, providing high-resolution
images of the smallest BGA components in very restricted spaces.
With a width of only 0.9mm, the contact prism chip at the base of
the BGA lens can fit into the tightest spaces and cope with the most challenging
samples.
The lighting design of the Hirox BGA Lens,
through a set of included specially designed lighting tools, allows the
user to direct sufficient light to the exact point of desired
inspection. The lens is also fitted with an optical rotation aspect
adjustment ring which allows the user to vary the actual angle of
inspection, thereby always making it possible to find the best viewing
angle at all times for a given sample.
With the highest quality lenses designed for nearly every type of inspection
and application, the Hirox Hi-Scope system
continues to demonstrate its wide range of inspection flexibility with
the natural addition of the MX-BGAZ BGA Inspection Lens.
|
|
|
|
|
MX-BGAZ (BGA Inspection Lens)
|
|
Click green icons for further details
Click here
for PDF Catalog
|
|
|
|
|
|
BGA Stand with XY stage and PC Board
Clamp
|
|
Now HIROX BGA System became
more user friendly than ever with newly developed Stand and Board clamp.
By rotating board clamp, you can change board orientation easily. Stand
has a stage built in with X and Y movement so that you can delicately
move the lens to X direction and a board to Y direction. The built in
Focus Block tilt forward so that you can easily replace BGA prism chips.
The light Guide Cable is now detachable so that you can use the same main
control unit (Camera and Light Source) for other HIROX lenses.
|
|
|
|
|
|
|
BGA Stand (ST-HK)
|
|
Item#
|
ST-HK
|
|
X-axis Movement
|
60mm
|
|
Y-axis Movement
|
190mm
|
|
Dimentions
|
W
|
466mm
|
|
H
|
297mm
|
|
D
|
420mm
|
|
Items included
|
ST-HK
|
BGA stand with focus block and stage
|
8.1kg
|
|
|
ST-HK
|
|
|
|
|
|
|
PC Board Clamp(AS-BH)
|
|
Item#
|
AS-BH
|
|
Max Board Size*
|
330mm x 250mm
|
|
Min Board Size
|
50mm x 50mm
|
|
Board clamped height from bottom
|
27mm
|
|
Dimentions
|
W
|
371mm
|
|
H
|
55mm
|
|
D
|
2830mm
|
|
Items included
|
AS-BH
|
PC Board Clamp
|
2.7kg
|
|
|
AS-BH
|
|
|
*Board larger than this size can be special odered.
|
|
|
|
BGA Stand with Board Clamp(ST-HY)
|
|
ST-Y and AS-PCB combined
item. Description and specifications are same as above.
|
|
|
|
|
BGA & Other SMT Sample Images
Click images for large picture
|
|
|
|
|
|
BGA 1st row
|
BGA 2nd row
|
BGA 3rd row
|
|
|
|
|
|
|
BGA 4th row
|
BGA chip
(3-D 200x-100x)
|
SMT Component
(150x)
|
|
|
|
|
|
|
J-Lead
(130x)
|
0.25 Pitch BGA
(320x)
|
Lead Free Solder
Lift-off ,Sn3Pb (80x)
|
|
|
|
|
Specification
|
|
Main Lens
|
MX-BGAZ, specially designed lens for BGA
inspection
|
|
Optical System
|
Crossfocus,
High Resolution Lens
(12 Optical Elements)
|
|
Prism Chip Mechanism
|
Soft-spring mechanism for protection of PC board
and
fiber optic back-lighting
|
|
Prism Chip
Width
|
0.9mm
|
|
Minimum Solder Height
|
0.3mm
|
|
Inspection Angles
|
Super Angle 90 degrees with fine adjustment.
|
|
Lighting Method
|
Optical 3-way lighting
|
|
Magnification Range
|
Magnification
|
50X
|
100X
|
200X
|
|
Working Distance
|
19.9mm
|
9.6mm
|
0.8mm
|
|
Magnification is varied by changing Working
Distance.
|
|
