Micro Electric
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IC (40x)
CD Data (2500x)
Micro Component (3-D 50x-300x Zoom)
CD Data (5000x)
QFP (3-D 100x)
BGA chip (3-D 200x-100x)
Through Hole (3-D 50x-300x Zoom)
Gold Plated Pin on IC (3-D 50x-300x) Click here for size ref.
Gold Plated Pin on IC (3-D 50x) 25° 35° 45° 55° Angle Views
Probe (L) (3-D 50x-200x) Click here for size ref.
Probe (S) (3-D 300x) Click here for size ref.
Wire Bonding (3-D 50x-300x)
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