Micro Electric
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SMT Component (150x 90° View with BGA Lens)
0.25 Pitch BGA (320x)
Lead Free Solder Lift-off ,Sn3Pb (80x)
Wafer Edge (3-D 50x)
Wafer Edge (3-D 200x)
Solder Ball for BGA (3-D 100x)
IC (40x)
Cell Phone Circuit Board (4x)
Cell Phone Circuit Board (5x 3D)
CCD Chip (7000x)
Solder Paste(140x) Auto Multi Focus
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